Tsmc 7nm Process Chip Again Broadcom Ai Chip

Broadcom unveiled its silicon-proven 7nm IP core that will power popular AI (Artificial Intelligence), 5G and high-bandwidth networking markets with Application Specific ASICs (ASICs). Broadcom to build 7-nanometer ASIC for customers to finalize the design finalized by the end of the year, Broadcom also said it will be 7 nanometer ASIC foundry and CoWoS package orders by TSMC is responsible for.

TSMC 7nm process leader in the industry, following the industry came Apple's new generation of A12 application processor, AMD a new generation of Vega graphics chip, a new generation of Qualcomm Snapdragon mobile chip, will use TSMC 7nm process chip, Broadcom also determined to use TSMC 7 Nanometer process to create ASIC platform, grab into the strong demand for AI and high-speed network and other markets.

Broadcom builds its ASIC platform based on TSMC's 7nm process and announces the industry's leading IP core for 7nm process silicon certification, including the high-speed serializer (SerDes), second- and third-generation high-bandwidth memory physical layer (HBM Gen2 / Gen3 PHY), Die2Die PHY, mixed signal and basic silicon intellectual property. As for the ASIC platform processor core ARM core and peripheral IP core.

Broadcom's 7-nanometer ASICs, in addition to locking AI applications such as deep learning, and gaining market access to high-performance computing (HPC) chips, will also integrate the memory such as HBM Gen2 / Gen3 directly into the chip using TSMC CoWoS advanced packaging technology. As for the high-speed SerDes IP core, it helps to build a high-speed switch or router application chip and complete a system single chip that supports 5G high-speed and broadband networks. Broadcom said that the 7nm ASIC for major early-stage customers has finalized the design at the end of last year.

For TSMC, 7nm is the highlight of this year's operation, the relevant capacity is expected to be completed this year after the construction, the amount of investment in the second quarter after the rapid rise. TSMC CEO Weizhe Wei last week, the legal note that the TSMC has 10 10-nanometer chips have been finalized design will be the second quarter will be able to enter the production stage, and the first quarter is estimated there will be another 10 7-nanometer chips The design will be finalized. By the end of this year, the number of 7-nanometer chip designs will exceed 50 and the major applications include mobile devices, games, CPUs, FPGAs, China Netcom and AI.

TSMC is expected in the first half of this year in U.S. dollars revenue growth will be slightly higher than 15% over the same period last year, second-half revenue growth will be slightly less than 10% over the same period last year. The industry said that TSMC first quarter revenue forecast will range from 8.4 to 8.5 billion US dollars to calculate the second quarter revenue performance will be slightly lower than the first quarter of 83 to 8.4 billion US dollars, and the third quarter began to recognize Column 7nm revenue, revenue is expected to jump to more than 9 billion US dollars, does not rule out the fourth quarter, there is a single quarter of revenue 10 billion US dollars possible.